Monday, May 30, 2016
VOLUME -27 NUMBER 5
Publication Date: 05/1/2012
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ARCHIVE >  May 2012 Issue >  Hi-Tech Events > 

APEX 2013 Call for Papers
Bannockburn, IL — IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® to be held at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 19-21, 2013, and the professional development courses will be February 17-18 and February 21, 2013.

The world's premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for "Best U.S. Paper" for U.S. authors and the "Best International Paper" for authors from outside the United States.

Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions dealing with lead-free processing, repair and reliability, high-speed PCB laminates and new research in growing areas such as green technology and printed electronics are especially encouraged.In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on printed board design and manufacturing as well as electronics assembly processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

Contact: Greg Munie, IPC conference director, E-mail: GregMunie@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org or847-597-2825.

 
 
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