Sunday, June 24, 2018
Publication Date: 05/1/2012
Archive >  May 2012 Issue >  Electronic Mfg. Products > 

Nihon Superior Intros Alloy in Spheres
Lead-free solder paste.
Osaka, Japan — Nihon Superior Co. Ltd. has introduced the first of the company's new SN100C Advantage Series alloys, SN99CN in the form of spheres and the solder paste SN99CN P502 D4. While based on the proven SN100C Sn-Cu-Ni technology, which now has a track record of more than 13 years of successful delivery of high productivity and reliability, SN99C has a controlled addition of Ag for enhanced strength and intermetallic stability.

In high-speed pull testing of joints reflowed to a copper substrate, its ranking in comparison with other common alloys in terms of fracture energy at pull speeds ≥10mm/s is: SN99CN>SN100CrSn-37Pb>Sn-3.0Ag-0.5Cu. SN100C is a compliant alloy that provides high impact strength and substantial cost advantages.

For situations where voiding must be minimized, the company has introduced SN100C P810 D4, which has been formulated specifically to facilitate optimum performance of nitrogen atmosphere vacuum reflow systems. While by itself the vacuum reflow process can be effective in achieving a much lower incidence of voiding than conventional reflow processes, its use with the SN100C P810 can further reduce the residual voiding to less than 1 percent of the joint area. This is particularly important in large area joints to components such as QFN where heat transfer has to be maximized. Wetting performance is not compromised and this paste typically can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 solder pastes with a peak around 240°C.

Contact: Nihon Superior Co. Ltd., NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063 Japan 81-(0)6-6380-1121 fax: 81-(0)6-6380-1262 Web:

search login