Tuesday, October 24, 2017
VOLUME -27 NUMBER 5
Publication Date: 05/1/2012
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Archive >  May 2012 Issue >  Front Page News > 
Solar Powered Hydrogen Filling Station


Freiburg, Germany — The Fraunhofer Institute for Solar Energy CF Systems inaugurated a solar hydrogen filling station in Freiburg on March 2. Sponsored by the Ministry of the Environment Baden-Wuerttemberg, the publicly accessible filling station serves not only as a demonstration platform but also represents a milestone in the development of a network of hydrogen filling stations being set up in the State of Baden-Wuerttemberg....
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PC Shipments to Have Strong Second Half

Framingham, MA — Worldwide PC shipment growth for 2011 ended on a slightly positive note, growing to 1.8 percent on the year, according to the International Data Corporation (IDC) Worldwide Quarterly PC Tracker. While the first half of 2012 is expected to see only modest shipment growth, the launch of Windows ...Read More
IPC Technology Roadmap: Vision of Future

Bannockburn, IL — The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released in February at IPC APEX EXPO® 2012. Published every two years, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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