Wednesday, May 23, 2018
VOLUME -27 NUMBER 5
Publication Date: 05/1/2012
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Archive >  May 2012 Issue >  Front Page News > 
Solar Powered Hydrogen Filling Station


Freiburg, Germany — The Fraunhofer Institute for Solar Energy CF Systems inaugurated a solar hydrogen filling station in Freiburg on March 2. Sponsored by the Ministry of the Environment Baden-Wuerttemberg, the publicly accessible filling station serves not only as a demonstration platform but also represents a milestone in the development of a network of hydrogen filling stations being set up in the State of Baden-Wuerttemberg....
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PC Shipments to Have Strong Second Half

Framingham, MA — Worldwide PC shipment growth for 2011 ended on a slightly positive note, growing to 1.8 percent on the year, according to the International Data Corporation (IDC) Worldwide Quarterly PC Tracker. While the first half of 2012 is expected to see only modest shipment growth, the launch of Windows ...Read More
IPC Technology Roadmap: Vision of Future

Bannockburn, IL — The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released in February at IPC APEX EXPO® 2012. Published every two years, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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