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Waveform Analyzer Module from Agilent
Publication Date: 3/27/2012

Santa Clara, CA — Agilent Technologies Inc. has introduced a precision waveform analyzer for engineers involved in design verification and validation of high-speed electrical communications systems and components. With reportedly industry-best residual jitter (below 50 femtoseconds), channel bandwidths ...
Assembleon Intros iFlex Platform
Publication Date: 3/27/2012

Eindhoven, the Netherlands — Assembleon is introducing iFlex in Asia after its successful first showings in Europe. iFlex is a new, innovative, intelligent and flexible SMT solution for electronics manufacturers. It is especially designed to increase productivity in high product mix environments ...
AdoptSMT Group Distributing Count On Tools Nozzles in Europe
Publication Date: 3/27/2012

Grodig bei Salzburg, Austria — Count On Tools has appointed AdoptSMT Europe GmbH as its distributor for all of Europe. AdoptSMT will be responsible for COT's complete range of replacement parts for the SMT industry including vacuum nozzles for pick-and-place machines.
CyberOptics Shows Newest AOI and SPI Systems
Publication Date: 3/27/2012

Minneapolis, MN — CyberOptics Corporation is introducing the QX100 tabletop AOI system, equipped with AI2 next-generation image analysis software along with a preview of its latest in-line AOI and SPI systems. The company's unusual value-add initiatives such as one-step SPI/AOI programming, AOI ...
F+K: Wire Bonders Outside the Mainstream
Publication Date: 3/27/2012

Munich, Germany — F and K Delvotec's new wire bonder, the G5-XL had been introduced at productronica 2011 and is at the heart of the company's diversification strategy away from a pure semiconductor business and towards other market segments such as PV manufacturing.
Henkel: High Tg, Reworkable Underfill
Publication Date: 3/27/2012

Irvine, CA — Expanding on its portfolio of advanced underfill materials, Henkel has developed LOCTITE UF3810, a new underfill technology that provides extremely high reliability while also allowing for easier reworkability as compared to previous generation products.
Hitachi Intros Multi-Function Placement Head
Publication Date: 3/27/2012

Dallas, TX — The new Sigma G5 compact, modular mounter, offered by The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA), incorporates an unusual multi-function head that greatly enhances the system's flexibility and overall process efficiency.
Koh Young: Advanced 3D AOI
Publication Date: 3/27/2012

Seoul, Korea — Koh Young Technology is exhibiting significant new enhancements and capabilities for its SPI and AOI inspection technologies including its new PCB warpage compensation capabilities for the Zenith AOI system. These capabilities are currently included on KY 3D SPI systems. Now, the Zenith ...
Kyzen Intros Improved Pallet Cleaner
Publication Date: 3/27/2012

Nashville, TN — Kyzen has introduced a new and improved product for cleaning pallets and maintenance applications. The product is in response to an industry need for a cleaning chemistry that would work at ambient temperatures and remove hardened, burnt on flux residues from pallets, reflow oven ...
Latest Laser Cutting & Welding Technology from LPKF
Publication Date: 3/27/2012

Tualatin, OR — LPKF is highlighting its UV laser systems, including the MicroLine 1120 S and 6120 S which are designed for depaneling populated PCBs and are suitable for cutting break-out tabs and complex contours with the highest accuracy.
Mentor Graphics PADS Release for DFM, Routing
Publication Date: 3/27/2012

Wilsonville, OR — Mentor Graphics Corp. has released the version of the PADS® product suite, reportedly the world's most widely used desktop PCB design solution. These additional features in the release add significant value to electronics companies as they strive to deliver the most competitive, high-performance ...
Nordson DAGE Unveils X-ray Inspection System
Publication Date: 3/27/2012

Fremont, CA — Nordson DAGE is now offering the XD7600NT Ruby FP x-ray inspection system that uses the latest technology, flat panel detector to provide the first choice for high quality real time imaging in production. The system uses the company's NT maintenance-free, sealed transmissive x-ray tube ...
Nordson ASYMTEK: Conformal, Jetting, & Dispensing
Publication Date: 3/27/2012

Carlsbad, CA — Nordson ASYMTEK's non-contact jet dispensing of underfill is intended for chip-scale packages, ball grid arrays, package-on-package, and conformal coating using a fifth-axis tilt accessory with four-position rotate for conformal coating of vertical surfaces and underneath components ...
OK Int'l Unveils Advanced Rework Solution
Publication Date: 3/27/2012

Garden Grove, CA — OK International is unveiling the new Metcal Scorpion Rework System, designed to meet the challenges of array package rework, and the accurate placement of BGAs, in particular. The new system allows for simultaneous viewing of Printed Circuit Board pads and component pads or balls ...
SEHO Adds Vision to PowerSelective Soldering System
Publication Date: 3/27/2012

Kreuzwertheim, Germany — SEHO Systems GmbH is exhibiting its PowerSelective soldering system, which embodies a modular design, to ensure the highest flexibility. The system offers the company's unusual multi-nozzle technology and can be customized to meet specific production requirements. The multi ...
Techcon Showcases Next-Gen Fluid Dispensing
Publication Date: 3/27/2012

Garden Grove, CA — Techcon Systems is showcasing an impressive lineup of products including precision valves — a range of dispensing and spray valves from simple manual dispensing to precision valves for high-speed automated applications. The company's comprehensive valve line includes easily-maintained ...
Vi Technology Intros Latest Hi Res Color AOI
Publication Date: 3/27/2012

Saint-Egreve, France — Vi Technology has introduced SPECTRO, its high resolution/high speed AOI solution for the most demanding of circuit board inspection requirements. The new camera technology is being shown on the company's new 2K SPECTRO AOI system. According to the company, faster inspection ...
Finetech: Professional Rework Systems
Publication Date: 3/27/2012

Berlin, Germany — Finetech is presenting two professional rework systems — the FINEPLACER® core plus and the FINEPLACER pico rs. The FINEPLACER core plus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven ...
Machine Vision: Wire Bond Inspection
Publication Date: 3/27/2012

Carlsbad, CA — Machine Vision Products (MVP) has a proven track record of success with a broad range of applications across both SMT and Microelectronics, covering commercial, medical and defense based devices. The Ultra 850G is Configured to 1µm pixel resolution and provides: inspection of wire ...
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