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VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
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Special Features: Assembly and Packaging
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April 2012 Issue
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SMTA Soldering Confab in Toronto
Minneapolis, MN — The SMTA's 2012 International Conference on Soldering and Reliability is being held May 15-18 at the Crowne Plaza Toronto Airport Hotel in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.
The technical conference features 30 presentations on topics ranging from BGA Voids to Conformal Coating to Design for Manufacturability and Package on Package assembly issues. Speakers will represent Celestica, Cookson Electronics, Creation Technologies, IBM, Indium Corporation, Intel Corporation, Nihon Superior Co., Rockwell Collins, Sandia National Laboratories, and many other companies and schools.
On Thursday, May 17, Paul Vianco, Ph.D. from Sandia National Laboratories will deliver the Keynote Presentation, "Computational Modeling: On the Critical Path for Predicting Solder Joint Reliability."
The SMTA Lead-Free Academy, Tuesday, May 15, will feature the following tutorials: "Troubleshooting the SMT and Through Hole Assembly Process using an Analytical Approach" (Full-Day); "Weeding out PCB Fabrication Defects Before Assembly" (Half-Day); "Tin Whiskers — a 2012 State of the Industry Assessment" (Half-Day). The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on Wednesday, May 16th. Conference participants may attend the expo at no charge.
Complimentary technical presentations will be offered throughout the day in the exhibit hall.
Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424
952-920-7682 fax: 952-926-1819 Web:
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