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VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
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Special Features: Assembly and Packaging
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April 2012 Issue
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IPC APEX EXPO Surges in San Diego
Bannockburn, IL — The electronic interconnect industry came together at IPC APEX EXPO
in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4,915 conference and exhibit hall attendees. IPC reported that 407 exhibitors participated in the event, resulting in 8,963 total visitors. The show was the best attended IPC APEX EXPO in more than four years. IPC APEX EXPO is the largest event in North America focused on the printed board and electronics manufacturing industries. "We are very pleased that the industry responded to IPC APEX EXPO in San Diego whether it was on the show floor, in classrooms or technical committee meetings," said Tony Hilvers, IPC vice president of industry programs. "All the exhibitors we talked to were very positive about both the quality and quantity of the leads. We've even received the first contract — with an expansion request — from an exhibitor for 2013."
Scott Wischoffer, representing Fuji America Corporation and chairman of the IPC APEX Trade Show committee added, "I'd like to thank everyone for making the show a spectacular event! The booth traffic was excellent, the leads were strong, and the excitement of a great upcoming year was something that could be felt. San Diego is a clean, beautiful, dynamic city with a great waterfront and an unrivaled selection of restaurants and bars within walking distance of the convention center. We're looking forward to coming back again next year for IPC APEX EXPO 2013!"
In addition to a lively show and conference, IPC APEX EXPO kicked off its first hand soldering contest, culminating in a Grand Championship competition. Adam Conaway, S and Y Industries, was named the Grand Champion, scoring ahead of the winner from IPC Midwest Conference & Exhibition Nicole DeVries, Raven Industries, and IPC Europe's Linnea Gyllner, TRIAB Elektronik AB.
IPC APEX EXPO will return to the San Diego Convention Center, February 19-21, 2013. Industry researchers, engineers and academics are invited to submit an abstract for consideration in next year's technical conference or professional development courses in the online call for participation.
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