Friday, May 27, 2016
VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
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ARCHIVE >  April 2012 Issue >  NEPCON China Product Preview > 

Koh Young: Advanced 3D AOI
Zenith AOI system.
Seoul, Korea — Koh Young Technology is exhibiting significant new enhancements and capabilities for its SPI and AOI inspection technologies including its new PCB warpage compensation capabilities for the Zenith AOI system. These capabilities are currently included on KY 3D SPI systems. Now, the Zenith AOI system can compensate for even the most serious warp conditions on FPCBs without sacrificing inspection cycle time.

In the SPI arena, the company's leading quad-projection 3D SPI system "aSPIre 2" and best-selling 3D SPI system "KY8030-3" will be on display. Visitors to the booth will be able to get a "sneak peek" at upcoming 3D SPI release software with a more user-friendly interface; for example, access to key functions is easier and faster from the main UI screen; and PCB views and Defect views offer a deeper 3D perspective.

The company will perform live demonstrations of its new closed-loop screen printer communications system. Its 3D SPI systems (aSPIre and KY8030 series) will show automated offset corrections that can be verified in real time through offset histograms and bull's-eye charts from the company's SPC Plus software.

Lastly, for the fast-growing population of smart mobile device users, Koh Young will introduce specific new apps where users can monitor their production line processes from remote locations, applicable to both 3D SPI and 3D AOI.

Contact: Koh Young America Inc., 6505 W. Frye Rd., Suite 14, Chandler, AZ 85266 480-403-5000 fax: 480-403-5001 E-mail : bill.astle@kohyoung.com Web:
http://www.kohyoung.com


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