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Tuesday, May 24, 2016
VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
NEPCON China Product Preview
April 2012 Issue
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Interplex Intros SMT Press-Fit Pins
Press-fit contacts for daughterboard.
East Providence, RI — Interplex Engineered Products has introduced a new patent-pending Surface Mount Technology (SMT) Card-Edge Connector System based on the company's press-fit technology. The new product is a discrete pick-and-place SMT component that creates a solderless edge card interconnection for daughter board applications. These SMT card-edge contacts can be placed on a daughter card using standard high-speed pick-and-place surface mount equipment.
The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection.
The SMT Card Edge Contact System is designed for standard 1.6mm (0.062-in.) thick PCBs but is also compatible with other PCB thicknesses. The center minimum PCB spacing is 3.2mm (0.126-in.). The product incorporates the company's proven and tested 0.64mm press-fit technology. It is packaged in a 16 x 4mm pitch EIA tape on a 13-in. diameter plastic reel for compatibility with standard high-speed surface mount pick-and-place equipment. It is suitable for high-conductivity material, able to carry up to 15amps per contact.
Contact: Interplex Industries, 14-34 110 St., Suite 301, College Point, NY 11356
718-961-6212 fax: 718-886-0573 Web:
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