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Saturday, December 16, 2017
VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
NEPCON China Product Preview
April 2012 Issue
Front Page News
Sandia: Working on the Bionic Man
Albuquerque, NM — Sandia National Laboratories researchers, using off-the-shelf equipment in a chemistry lab, have been working on ways to improve amputees' control over prosthetics with direct help from their own nervous systems.
Multitasking: A Deadly Habit
By Thomas Adams
You are doing 50 mph in the right lane, using your hands-free cell phone to sort out an upcoming business meeting. Ahead of you, a lost driver, partly obscured by a row of trees, is coming down a street that intersects the highway you are on. The driver will run the stop sign and appear broadside ...
Printed Electronics to Reach $9.4 Billion in 2012
By Raghu Das, CEO, IDTechEx
Cambridge, U.K. — The market for printed and potentially printed electronics in 2012 will be $9.4 Billion according to new research by IDTechEx. This figure includes devices not yet printed today but which are moving towards being printed. Of this market, 30 percent of the devices studied are made ...
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
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