Friday, May 26, 2017
VOLUME - NUMBER
Advertisements
Below the Fold > 
Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017

CLINTON, NY - Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.
Read More
SEMI | FlexTech and CPEIA Announce Partnership at CPES2017

MILPITAS, CA - SEMI | FlexTech (www.semi.org; www.flextech.org) and the Canadian Printable Electronics Industry Association (www.cpeia-acei.ca) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).
Read More
Ventec: Thomas Michels to Speak at the EIPC Summer Conference

SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
Read More
Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
 
Read More
 
 
search login