Wednesday, July 26, 2017
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International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

SAN JOSE, CA - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

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LUTZE Introduces Teal Ethernet Cat5e Cable

CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.
 
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NXP Announces Production of Security Chips in its US Manufacturing Facilities

AUSTIN, TX; CHANDLER, AZ - NXP Semiconductors N.V. today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 
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SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

MINNEAPOLIS, MN - SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks.
 
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FOBA showcasing at the Fakuma – Laser marking on plastics

SELMSDORF - At the Fakuma, the international exhibition for plastics processing in Friedrichshafen/Germany (October 17-21, 2017), FOBA will be showcasing special marking solutions for different plastics. As an internationally leading manufacturer of laser marking systems, FOBA will be presenting product news about the M3000-UV for sensitive plastics and new marking solutions especially made for day-night-design.
 
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