Thursday, December 14, 2017
VOLUME - NUMBER
Advertisements
Below the Fold > 
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry

MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. Read More
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology

SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. Read More
ElectroCraft Introduces the CompletePowerâ„¢ Plus Universal Drive

DOVER, NH - ElectroCraft, Inc., the global fractional horsepower motor, and motion solutions provider, has expanded their CompletePower™ Plus family of BLDC motor drives offering with the CompletePower™ Plus Universal Drive. The Universal Drive takes performance, efficiency and flexibility to the next level, utilizing state-of-the-art digital drive technology combined with an intuitive and highly configurable user interface. The CompletePower™ Plus comes in three standard capacities with customized options available for OEMs. Read More
RAMPF Group continues to grow: Financial year 2016/17: Consolidated sales rise 10.5 percent from 153 to 169 million euros / Workforce increases by 10.9 percent

GRAFENBERG - The international RAMPF Group is continuing on its growth path – consolidated sales in the last financial year 2016/17 were 169 million euros, a rise of 10.5 percent on the previous year. Read More
 
 
search login