Sunday, October 22, 2017
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New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

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Avnet Opens Registration for Global MiniZed SpeedWay Design Workshop Series: Training gives engineers head start in mastering design flows using Xilinx’s Vivado Design Suite

PHOENIX, AZ - Avnet, a leading global technology distributor, today announced that registration is now open for a series of interactive SpeedWay Design Workshops™ to help engineers jump start the development of single-core Xilinx® Zynq®-7000 All Programmable SoC devices using the Avnet MiniZed™ Zynq SoC development kit, a cost-optimized prototyping platform for embedded vision and Industrial IoT systems.Read More
Coto Technology Awarded "Best of Show" (Silver) at Sensors Midwest 2017

ROSEMONT, IL - Coto Technology has been awarded Sensors Midwest's Best of Show "Silver" award for its newly-released RedRock TMR RR121 Magnetic Sensor. Seeking to replace aging magnetic sensor technology, the RR121 represents a huge breakthrough for design engineers seeking the lowest possible power consumption and highest sensitivity in an ultra-miniature package.Read More
 
 
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