Tuesday, May 23, 2017
Below the Fold > 
Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging

CLINTON, NY - Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.
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Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
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