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Thursday, May 25, 2017
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Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY -
’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.
SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (
) and the Canadian Printable Electronics Industry Association (
) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
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