Monday, May 21, 2018
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Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters

Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        Read More
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018

BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    Read More
 
 
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