Friday, May 25, 2018
VOLUME - NUMBER
Advertisements
Below the Fold > 
Indium Corporation Expert to Present at PCIM Europe

CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 
Read More
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program

MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         Read More
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters

Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        Read More
 
 
search login