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Viscom: 3-D SPI AOI System with Uplink
AOI SPI system.
Atlanta, GA — Viscom is showing its recently introduced 3-D SPI system now available with the special SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.
The new S3088 SPI 3-D solder paste inspection system is based on the field-proven S3088 platform, combining efficiency and user-friendliness.
The new product uses highly accurate measurement data available of the paste print to optimize post-reflow automatic optical inspection (AOI) at the end of the production line. SPI measurement data are typically only used to classify paste print, allowing high tolerances of up to ±50 percent volume. Viscom's new SPI-AOI Uplink feature enables the use of information later in the process to assure post-reflow defect detection while allowing high variability of the paste print process.
The evaluation of process errors, such as marginal print results that are just below the defect threshold, provides valuable information about the expected solder joint quality. For every solder joint that is subject to post-reflow inspection, the volume, shape and position data of the corresponding solder paste deposit is made known to the AOI via the Uplink interface. This allows users to automatically adapt the post-reflow AOI inspection parameters according to the expected defect type.
Too little paste volume often leads to open solder joints while solder bridges could be the product of excessive paste deposits. The tighter classification of the AOI consequently results in better defect detection while reducing false alarms.
In addition, the depiction of paste images and additional data, together with AOI solder joint images at the post-reflow verification station, enhances the manual classification process.
Contact: Viscom USA, 1775 Breckinridge Parkway, Suite 500, Duluth, GA 30096
678-966-9835 fax:678-966-9828 E-mail: info@ViscomUSA.com Web:
See at IPC/APEX Booth #2629.
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