Wednesday, April 25, 2018

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BGA Solder Ball Inspection from ScanCAD
BGA inspection scanner.
Littleton, CO — ScanCAD International is releasing its latest low-cost inspection system in its extensive family of process control tools. ScanINSPECT BGA provides a fast, simple, and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, slow, measurement systems. An intuitive user interface integrated with a high-resolution, color, 2-D image processing unit allows 100 percent inspection of ball placement on BGAs, in or out of trays. This desktop offline system can be used for either pre- or post-reflow ball inspection. According to the company, inspecting each tray of BGAs after production is essential for any supplier that wants 100 percent inspection versus relying on the subjective eyes of an operator. ScanCAD now provides a low-cost and effective solution for inspecting solder ball placement.

ScanINSPECT BGA inspects balls for presence or absence, size, position, extra balls, and surface quality.

Each device or tray is placed on the table, shuttled in, automatically aligned and inspected with a PASS or FAIL result in seconds. Problems are identified and eliminated before and/or after reflow, permitting quick and easy rework and a final quality inspection providing full traceability.

ScanINSPECT BGA comes with its own inspection platform, a high quality hardware apparatus with a drawer system for placing the trays and performing the inspection. The high resolution scanner and customer tooling ensure repeatability of scanning and inspection.

Contact: ScanCAD International, Inc., 12779 West Belleview Ave., Littleton, CO 80127 303-697-8888 E-mail: Web:

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