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Nihon Superior Intros New Lead-Free Solder
SN100C P520 lead-free solder paste.
Osaka, Japan — Nihon Superior Co. Ltd. is introducing the latest addition to its SN100C lead-free solder series, a flux-core wire solder. The new 551CT formulation combines the benefits of the SN100C high reliability alloy with a sustained activity cored flux. The 551CT core flux is formulated for use with soldering tip temperatures up to 380°C while still retaining sufficient activity to ensure good tip separation.
Compared with previous formulations icicling is reduced by 90 percent and spattering by 95 percent. The silver-free SN100C alloy has a stable microstructure that can accommodate both the long-term cyclic strain and the impact loading to which solder joints can be subjected in service.
551CT is suitable for sequential soldering and rework. Now in the 13th year since its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion, and cost-effectiveness.
A lead-free solder paste, SN100C P520 is a high-reliability no-clean formulation optimized to deliver good reflow with chip components down to 01005 (0402 metric). SN100C P520 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine-pitch mounting in which a reduction in joint strength is a concern due to the very small joint size. Additional benefits include low residue, excellent reflow characteristics on small pads, good hot slump performance, stable printability on small pads, excellent wetting behavior, even on brass and nickel. As an additional benefit to users, SN100C P520 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with 240°C peak. The paste is a compliant alloy that provides impact strength and substantial cost advantages.
Contact: Nihon Superior Co. Ltd., NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063 Japan
81-(0)6-6380-1121 fax: 81-(0)6-6380-1262 Web:
See at IPC/APEX Booth #3044.
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