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Nordson DAGE Intros X-Plane to U.S. Market
Image comparisons: 2D at left; right side shows two X-Plane slices.
Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, is introducing X-Plane
to the U.S. market for the first time. This new option for the company's range of X-ray inspection systems uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image quality inherent in the company's X-ray systems can now be extended into separating individual layers at a level of excellence not achieved by traditional laminography techniques.
X-Plane technology is quick, simple and easy-to-use. The board is placed in the X-ray inspection system and X-ray images are taken 360° around the region of interest. X-Plane shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, and LGA. In addition, the technology can identify Head-on-Pillow (HoP) and open joints.
Also on display, the Nordson DAGE XD7600NT Diamond FP and XD7600NT Ruby FP are the ultimate flat panel inspection systems with QuickView CT. The inspection systems utilize the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today.
Contact: Nordson DAGE, 48065 Fremont Blvd., Fremont, CA 94538-6541
See at IPC/APEX Booth #3208.
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