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VOLUME -27 NUMBER 3
Publication Date: 03/1/2012
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Electronic Mfg. Services
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Special Features: Assembly and Packaging
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March 2012 Issue
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Xenon Unveils Next Gen Sintering
Sintering system for printable conductors.
Wilmington, MA — New from Xenon Corporation, the Sinteron 2010 reportedly delivers even greater flexibility for sintering conductive Cu and Ag metallic inks, curing thin-film substrates and for solar and surface modifications. While the most recent generation — the Sinteron 2000 — had four preset values for the pulse widths, the Sinteron 2010 allows for digitally programmable pulse widths. The ability to dial up just about any desired width makes the new furnace extremely flexible and valuable to process development.
A number of attractive features are designed into this 19-in. rack-based standalone system.The pulse amplitude can be adjusted like the Sinteron 2000. The pulse width for the Sinteron 2010 is adjustable in increments of 5µs in the range of 100µs to 2,000µs. By having total control of the pulse amplitude and pulse width, the optical energy delivered by the system can be precisely controlled. As the pulse profile is very linear at maximum amplitude a relationship of 1000J/ms can be assumed.
The Sinteron 2010 allows connection for either Spiral or Linear Lamp housings. These can provide optical footprints of 19 x 305mm (0.75 x 12-in.) or 127mm (5-in.) diameter areas. Because the company manufactures lamps and lamp housings, other optical profiles are readily available.
The new system can be used for photonic sintering of conductive inks for printed electronics in areas such as displays, smart cards, RFID and solar applications. The non-contact low thermal characteristics for this process makes it suitable for web-based printing techniques such as inkjet, flexography, gravure, and screenprint.
Contact: Xenon Corporation, 37 Upton Drive, Wilmington, MA 01887-1018
800-936-6695 or 978-661-9033 fax: 978-661-9055 E-mail: firstname.lastname@example.org Web:
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