Save. Share. Connect.
Saturday, July 23, 2016
VOLUME -27 NUMBER 3
Publication Date: 03/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
IPC / APEX Product Preview
March 2012 Issue
Add Message Board
Richardson RFPD Intros 3rd Gen Anaren Couplers
Hybrid and directional couplers.
LaFox, IL — Richardson RFPD, Inc. has inaugurated full design support capabilities for the Xinger
-III line of components from Anaren. The Xinger-III line of 3dB hybrid and directional couplers represent the latest additions to Anaren's popular Xinger-brand of subminiature components for wireless infrastructure applications. When compared to equally-sized parts from the previous generation, the new hybrid couplers offer 52-66 percent lower insertion loss (down to 0.12dB), 5 times the power handling capability, 25-28 percent higher isolation, 63-71 percent better amplitude balance, and equal phase balance.
The Xinger-III directional couplers are 1/4 the size of the Xinger-II line and offer 37-64 percent lower insertion loss (down to 0.05 dB), 50 percent higher power handling, and equal directivity. The parts are available as an option for customers who want the smaller footprint and performance gains to keep pace with next generation base station equipment designs; previous generations of Xinger models are still in production and available.
There are 14 different components now available in the Xinger-III product line, consisting of hybrid couplers and directional couplers in a number of different wattages and frequency ranges.
The new components incorporate patent-pending design and new materials advances. Their small footprint and robust power-handling capability make them viable alternatives to ceramic equivalents, thereby avoiding the risk of cracked solder joints that ceramics can create when their thermal expansion characteristics do not match the PCB on which they are mounted. The Xinger-III components are softboard, so the co-efficient of thermal expansion (CTE) disparity is not an issue, liberating designers to specify ordinary PCBs without concern about CTE mismatch.
The 0.25 x 0.2-in. (6.4 x 5mm) and 0.56 x 0.2-in. (14 x 5mm) footprints of the Xinger-III components are standardized from previous Xinger generations, facilitating cost control measures for the standardized equipment increasingly required for OEMs in wireless infrastructure markets.
Contact: Richardson Electronics RFPD, PO Box 307, LaFox, IL 60147-0307
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM