Monday, May 29, 2017
VOLUME -27 NUMBER 2
Publication Date: 02/1/2012
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Archive >  February 2012 Issue >  Front Page News > 
Doping Graphene Sheets for Device and Interconnect

Atlanta, GA — Nanotechnology researchers at the Georgia Institute of Technology have conducted the first direct comparison of two fundamental techniques that could be used for chemically doping sheets of two-dimensional graphene for the fabrication of devices and interconnects.
 
Chemical doping is routinely used in conventional three-dimensional semiconductors to control the density of electron carriers that are essential to the operation of devices such as transistors. But graphene, a semi-metal available in sheets just one atom thick, has properties very different from traditional materials such as silicon — though researchers say doping will still be needed for ...
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Rod Howell: EMS Biz Returning to USA

Mentor, OH — Where do SMTA Board Members and Presidents come from? Mentor, Ohio is one such place, where former SMTA President (a volunteer, non-paid position) Rod Howell steers his contract electronics manufacturing company Libra Industries on a straight path to long-term success. A privately held company, Libra has been in business for more than 30 years, and it was early during that time  ...
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Commerce Dept Reports on America Competes

Gaithersburg, MD — On Jan. 6, 2012, the U.S. Department of Commerce (DOC) issued a new report highlighting key policy priorities to sustain and promote American innovation and economic competitiveness. The report, "The Competitiveness and Innovative Capacity of the United States," examines the historic role ...Read More


 
 
SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium
MINNEAPOLIS, MN - The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.


Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY - Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.

SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (www.semi.org; www.flextech.org) and the Canadian Printable Electronics Industry Association (www.cpeia-acei.ca) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).

Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.

 
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