Friday, June 23, 2017
VOLUME -27 NUMBER 2
Publication Date: 02/1/2012
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Archive >  February 2012 Issue >  Front Page News > 
Doping Graphene Sheets for Device and Interconnect

Atlanta, GA — Nanotechnology researchers at the Georgia Institute of Technology have conducted the first direct comparison of two fundamental techniques that could be used for chemically doping sheets of two-dimensional graphene for the fabrication of devices and interconnects.
 
Chemical doping is routinely used in conventional three-dimensional semiconductors to control the density of electron carriers that are essential to the operation of devices such as transistors. But graphene, a semi-metal available in sheets just one atom thick, has properties very different from traditional materials such as silicon — though researchers say doping will still be needed for ...
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Rod Howell: EMS Biz Returning to USA

Mentor, OH — Where do SMTA Board Members and Presidents come from? Mentor, Ohio is one such place, where former SMTA President (a volunteer, non-paid position) Rod Howell steers his contract electronics manufacturing company Libra Industries on a straight path to long-term success. A privately held company, Libra has been in business for more than 30 years, and it was early during that time  ...
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Commerce Dept Reports on America Competes

Gaithersburg, MD — On Jan. 6, 2012, the U.S. Department of Commerce (DOC) issued a new report highlighting key policy priorities to sustain and promote American innovation and economic competitiveness. The report, "The Competitiveness and Innovative Capacity of the United States," examines the historic role ...Read More


 
 
Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

SEMI Europe Applauds New Semiconductor Manufacturing Investment
BERLIN, GERMANY - SEMI Europe today commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional innovation. SEMI Europe, the European regional office of the global industry association SEMI, engages SEMI members to advance the global electronics manufacturing supply chain.

 
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