Friday, April 20, 2018
VOLUME -27 NUMBER 2
Publication Date: 02/1/2012
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Archive >  February 2012 Issue >  Front Page News > 
Doping Graphene Sheets for Device and Interconnect

Atlanta, GA — Nanotechnology researchers at the Georgia Institute of Technology have conducted the first direct comparison of two fundamental techniques that could be used for chemically doping sheets of two-dimensional graphene for the fabrication of devices and interconnects.
 
Chemical doping is routinely used in conventional three-dimensional semiconductors to control the density of electron carriers that are essential to the operation of devices such as transistors. But graphene, a semi-metal available in sheets just one atom thick, has properties very different from traditional materials such as silicon — though researchers say doping will still be needed for ...
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Rod Howell: EMS Biz Returning to USA

Mentor, OH — Where do SMTA Board Members and Presidents come from? Mentor, Ohio is one such place, where former SMTA President (a volunteer, non-paid position) Rod Howell steers his contract electronics manufacturing company Libra Industries on a straight path to long-term success. A privately held company, Libra has been in business for more than 30 years, and it was early during that time  ...
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Commerce Dept Reports on America Competes

Gaithersburg, MD — On Jan. 6, 2012, the U.S. Department of Commerce (DOC) issued a new report highlighting key policy priorities to sustain and promote American innovation and economic competitiveness. The report, "The Competitiveness and Innovative Capacity of the United States," examines the historic role ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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