Wednesday, September 20, 2017
VOLUME -27 NUMBER 2
Publication Date: 02/1/2012
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Archive >  February 2012 Issue >  Front Page News > 
Doping Graphene Sheets for Device and Interconnect

Atlanta, GA — Nanotechnology researchers at the Georgia Institute of Technology have conducted the first direct comparison of two fundamental techniques that could be used for chemically doping sheets of two-dimensional graphene for the fabrication of devices and interconnects.
 
Chemical doping is routinely used in conventional three-dimensional semiconductors to control the density of electron carriers that are essential to the operation of devices such as transistors. But graphene, a semi-metal available in sheets just one atom thick, has properties very different from traditional materials such as silicon — though researchers say doping will still be needed for ...
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Rod Howell: EMS Biz Returning to USA

Mentor, OH — Where do SMTA Board Members and Presidents come from? Mentor, Ohio is one such place, where former SMTA President (a volunteer, non-paid position) Rod Howell steers his contract electronics manufacturing company Libra Industries on a straight path to long-term success. A privately held company, Libra has been in business for more than 30 years, and it was early during that time  ...
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Commerce Dept Reports on America Competes

Gaithersburg, MD — On Jan. 6, 2012, the U.S. Department of Commerce (DOC) issued a new report highlighting key policy priorities to sustain and promote American innovation and economic competitiveness. The report, "The Competitiveness and Innovative Capacity of the United States," examines the historic role ...Read More


 
 
SEMICON Europa Moves to Munich, Empowering Innovation and Shaping the Value Chain: New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa’s impact
MUNICH, GERMANY - SEMICON Europa 2017 will take place in Munich for the first time, co-located with productronica (14-17 November in Munich, Germany). SEMICON Europa will showcase the critical issues shaping the entire electronics manufacturing supply chain.
 
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