Santa Clara, CA — Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, has refined its pulse plating process at its Santa Clara board fab. This is expected to result in further enhancing the high aspect ratio capability. The integration is a result of the company's anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs.
|Test interface boards. |
Leveraging the advantages of its continually refined manufacturing process, Multitest now is able to build 0.3mm through-hole constructions and boards with even higher layer count for high pin count, 0.4mm fine-pitch array applications.
Contact: Multitest Electronic Systems, Inc., 3021 Kenneth Street, Santa Clara, CA 95054 408-988-6544 fax: 408-988-2948 E-mail: email@example.com Web: http://www.multitest.com