Save. Share. Connect.
Sunday, May 29, 2016
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: productronica
December 2011 Issue
Add Message Board
Brewer Science Joins EV Group in Tech. Pact
Rolla, MO, USA and St. Florian, Australia — Brewer Science, Inc. and EV Group (EVG), have made an agreement on ZoneBOND
technology. The agreement will enable both companies to commercialize the groundbreaking technology for customers in the temporary wafer bonding market.
The ZoneBOND technology provides a breakthrough approach for temporary wafer bonding, thin wafer processing, and debonding applications which overcomes the last remaining limitations associated with thin wafer processing. The technology allows the use of silicon, glass, and other carriers, and is compatible with existing, field-proven adhesive platforms. It enables debonding at room temperature with virtually no vertical force being applied to the device wafer.
Contact: Brewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401
573-364-0300 fax: 573-368-3318 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM