Friday, May 25, 2018
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Front Page News > 
Dec '11: Chipping Away at Antimatter Mysteries

Gaithersburg, MD — While they're not quite ready to build a Warp Drive for interstellar space travel, a team of researchers working at the National Institute of Standards and Technology (NIST) has just concluded a 10-year-long study of the fate of neutrons. They're still trying to discover why there   is "stuff" in the universe — more properly, why there is an imbalance between matter and antimatter — one of the long-standing mysteries of cosmology ...
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Thailand Floods Mean HDD Shortages


The impact of the October/November monsoon floods in Thailand on many high technology industries has been considerable. Perhaps none have been as hard hit as the HDD industry where major plants for Western Digital and Toshiba were flooded and many major HDD component suppliers were flooded as well ...Read More
TE & Juice Team Up to Deliver Smart Charging for Electric Vehicles

Troy, MI — TE Connectivity (TE) and Juice Technologies, doing business as "Plug Smart", have teamed up to provide smart Electric Vehicle (EV) charging solutions enabling customers to meter their EV's electricity consumption and to communicate data via an innovative smart charging cord and socket ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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