Monday, October 23, 2017
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Front Page News > 
Dec '11: Chipping Away at Antimatter Mysteries

Gaithersburg, MD — While they're not quite ready to build a Warp Drive for interstellar space travel, a team of researchers working at the National Institute of Standards and Technology (NIST) has just concluded a 10-year-long study of the fate of neutrons. They're still trying to discover why there   is "stuff" in the universe — more properly, why there is an imbalance between matter and antimatter — one of the long-standing mysteries of cosmology ...
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Thailand Floods Mean HDD Shortages


The impact of the October/November monsoon floods in Thailand on many high technology industries has been considerable. Perhaps none have been as hard hit as the HDD industry where major plants for Western Digital and Toshiba were flooded and many major HDD component suppliers were flooded as well ...Read More
TE & Juice Team Up to Deliver Smart Charging for Electric Vehicles

Troy, MI — TE Connectivity (TE) and Juice Technologies, doing business as "Plug Smart", have teamed up to provide smart Electric Vehicle (EV) charging solutions enabling customers to meter their EV's electricity consumption and to communicate data via an innovative smart charging cord and socket ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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