Sunday, December 4, 2016
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Front Page News > 
Dec '11: Chipping Away at Antimatter Mysteries

Gaithersburg, MD — While they're not quite ready to build a Warp Drive for interstellar space travel, a team of researchers working at the National Institute of Standards and Technology (NIST) has just concluded a 10-year-long study of the fate of neutrons. They're still trying to discover why there   is "stuff" in the universe — more properly, why there is an imbalance between matter and antimatter — one of the long-standing mysteries of cosmology ...
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Thailand Floods Mean HDD Shortages


The impact of the October/November monsoon floods in Thailand on many high technology industries has been considerable. Perhaps none have been as hard hit as the HDD industry where major plants for Western Digital and Toshiba were flooded and many major HDD component suppliers were flooded as well ...Read More
TE & Juice Team Up to Deliver Smart Charging for Electric Vehicles

Troy, MI — TE Connectivity (TE) and Juice Technologies, doing business as "Plug Smart", have teamed up to provide smart Electric Vehicle (EV) charging solutions enabling customers to meter their EV's electricity consumption and to communicate data via an innovative smart charging cord and socket ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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