Thursday, June 29, 2017
VOLUME - NUMBER
Advertisements


Home/Current Issue >  Product Previews > 

Viscom: 3-D Solder Paste Inspection System

Hanover, Germany — Viscom AG's new S3088 3-D SPI solution integrates the tried and tested sensor technology from CyberOptics. The new 3-D SPI system checks paste printing with the highest possible speed and precision and enjoys high demand.
 
 
 
search login