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Omron Focuses on High-Speed PCB Inspection Solutions
Publication Date: 10/31/2011

Schaumburg, IL — Omron Inspection Systems is introducing high-speed enhancements for its VT-RNS Automated Optical Inspection System. The enhancements were developed to help manufacturers shorten program generation, improve inspection cycle time and eliminate escapes and reduce false calls while maintaining ...
Orpro Vision: Advanced Inspection Systems
Publication Date: 10/31/2011

Hameln, Germany — ORPRO Vision is showcasing its AOI systems — its complete range of paste and component inspection systems and the new benchtop for post-placement and post-solder inspection.
Pemtron: Solder Paste Inspection Solutions
Publication Date: 10/31/2011

Seoul, Korea — Pemtron is introducing the new TROI 2200TL table top and TROI 5700HL in-line 3D solder paste inspection systems. The systems are now available in two new models: the TROI 5700HL system offering in-line, high-resolution, high-speed, dual projection 3D solder paste inspection for large PCB boards, up to 500 x 460mm (20 x 18-in.) and the new TROI 2200TL tabletop ...
Plasma Etch Intros Convertible Plasma
Publication Date: 10/31/2011

Carson City, NV — Plasma Etch has introduced a new plasma system that incorporates two individual plasma etching/cleaning type/mode technologies into one complete standalone plasma etching/cleaning system. Called the PE-100 Convertible, it gives the user the ability to switch back and forth between ...
Purex Develops New Fume Extraction System
Publication Date: 10/31/2011

Rotherham, UK — Purex International has introduced a new fume extraction machine to protect workers from exposure to hazardous solder fumes. When soldering without effective control, solder flux fumes are likely to enter the breathing zone of the solderer, which can lead to the development of occupational ...
SEHO: Modular soldering System
Publication Date: 10/31/2011

Erlanger, KY — SEHO's SelectiveLine, is a modular system concept for mini-wave soldering that may be adapted to changing production conditions at any time. With low production quantities, for example, only the SelectiveLine solder module is required. With increasing throughput requirements or very ...
Seica: Fast Prober, ICT and Boundary Scan
Publication Date: 10/31/2011

Strambino, Italy — Electronic test solutions from Seica start with the Pilot V8 Flying Prober with automatic loader; continue with the innovative in-circuit and functional line tester, Compact SL. Then there is the Firefly Laser Selective Soldering system. In addition, the company's test equipment ...
Surface Analysis Software for Zeiss Microscopes
Publication Date: 10/31/2011

Thornwood, NY — Carl Zeiss and Digital Surf have signed an agreement enabling Carl Zeiss to provide ConfoMap® software. ConfoMap is a surface imaging and analysis software for confocal microscopes and compound microscopes for topographical research.
TE Connectivity: Next-Gen Solutions
Publication Date: 10/31/2011

London, UK — TE Connectivity is featuring many new technologies including Electrical Network Solutions & Cable and Management in support of next generation aircraft EWIS and current return requirements.
Techcon Debuts New Packaging for DMP Inserts
Publication Date: 10/31/2011

Garden Grove, CA — Techcon Systems, a product group of OK International, is introducing new packaging and labels for DMP6-10, DMP8-10 and DMP16-10 inserts. The new packaging provides enhanced protection of the DMP inserts during the shipping and handling process. As an additional benefit, the box ...
Virtual Industries: Vacuum Handling Solutions
Publication Date: 10/31/2011

Colorado Springs, CO — The Small Part Handling Kit (TV1000-SP8-BD-MAG1), from Virtual Industries Inc. is for parts as small as 01005. This general-purpose vacuum handling tool plugs directly into 110V 50/60Hz. The compact unit will handle a variety of optics, ball lenses and SMT parts used in the ...
Viscom: 3-D Solder Paste Inspection System
Publication Date: 10/31/2011

Hanover, Germany — Viscom AG's new S3088 3-D SPI solution integrates the tried and tested sensor technology from CyberOptics. The new 3-D SPI system checks paste printing with the highest possible speed and precision and enjoys high demand.
XJTAG Releases BGA Testing App for 'Scopes
Publication Date: 10/31/2011

Cambridge, UK — Boundary scan specialist XJTAG is one step closer to integrating its debugging software XJAnalyser with an oscilloscope, following talks with several leading manufacturers.
 
With Ball Grid Arrays (BGAs) becoming more prolific, engineers are increasingly looking for a ...
YXLON: Digital Laminography Breakthrough
Publication Date: 10/31/2011

Hamburg, Germany — YXLON, a part of the COMET Group, has developed a groundbreaking new solution for more efficient, non-destructive testing of large, flat objects using digital laminography. This marks the latest step in the rigorous implementation of the company's technology development.According ...
Zestron Tech Center Adds AQT Trident LD Batch Cleaner
Publication Date: 10/31/2011

Manassas, VA — Aqueous Technologies has equipped Zestron's US Technical Center in Manassas, Virginia, with a Trident LD Batch Cleaner.
Acculogic: Ground-Breaking Test Technologies
Publication Date: 10/31/2011

Maple Grove, MN — Acculogic GmbH is showcasing its FLS 980Dxi Flying Scorpion, the only patented double-sided, multi-probe (22) flying probe system with 3-D probing, analog, digital and boundary scan test capability on all probes (top- and bottom-side).
AdoptSMT Adds Production Parts & Tools
Publication Date: 10/31/2011

Grodig near Salzburg, Austria — AdoptSMT Group Europe celebrates its 20th anniversary by introducing many new product ideas and services, focusing on the company's rapidly growing second core sector of supplying spare parts, tools and consumables.
Aegis Software Improves Production Efficiency & Quality
Publication Date: 10/31/2011

Horsham, PA — EE Technologies, Inc., an ISO/TS 16949:2009 certified Contract Manufacturer, recently completed a full implementation of Aegis' Manufacturing Operations Software (MOS). According to the company, this was effective in fulfilling its strategy to improve efficiencies and quality by streamlining and ...
AIM: Lead-Free and Tin-Lead Solder Pastes
Publication Date: 10/31/2011

Cranston, RI — AIM's most robust solder paste, NC258, has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. The paste reduces defects such as voiding and head-in-pillow.
 
The superior wetting ability of this paste results in bright, smooth and shiny solder joints. In addition, the paste offers very ... 
Assembleon Intros Back-End Assembly System
Publication Date: 10/31/2011

Eindhoven, Netherlands — Assembleon has made its official appearance in the semiconductor industry with a dedicated solution. The company has launched the A-Series Hybrid, a new solution within its A-Series lineup targeting manufacturers in the semiconductor back end industry. The A-Series Hybrid ...
 
 
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