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Zestron Tech Center Adds AQT Trident LD Batch Cleaner
Publication Date: 10/31/2011

Manassas, VA — Aqueous Technologies has equipped Zestron's US Technical Center in Manassas, Virginia, with a Trident LD Batch Cleaner.
YXLON: Digital Laminography Breakthrough
Publication Date: 10/31/2011

Hamburg, Germany — YXLON, a part of the COMET Group, has developed a groundbreaking new solution for more efficient, non-destructive testing of large, flat objects using digital laminography. This marks the latest step in the rigorous implementation of the company's technology development.According ...
XJTAG Releases BGA Testing App for 'Scopes
Publication Date: 10/31/2011

Cambridge, UK — Boundary scan specialist XJTAG is one step closer to integrating its debugging software XJAnalyser with an oscilloscope, following talks with several leading manufacturers.
With Ball Grid Arrays (BGAs) becoming more prolific, engineers are increasingly looking for a ...
Viscom: 3-D Solder Paste Inspection System
Publication Date: 10/31/2011

Hanover, Germany — Viscom AG's new S3088 3-D SPI solution integrates the tried and tested sensor technology from CyberOptics. The new 3-D SPI system checks paste printing with the highest possible speed and precision and enjoys high demand.
Virtual Industries: Vacuum Handling Solutions
Publication Date: 10/31/2011

Colorado Springs, CO — The Small Part Handling Kit (TV1000-SP8-BD-MAG1), from Virtual Industries Inc. is for parts as small as 01005. This general-purpose vacuum handling tool plugs directly into 110V 50/60Hz. The compact unit will handle a variety of optics, ball lenses and SMT parts used in the ...
Techcon Debuts New Packaging for DMP Inserts
Publication Date: 10/31/2011

Garden Grove, CA — Techcon Systems, a product group of OK International, is introducing new packaging and labels for DMP6-10, DMP8-10 and DMP16-10 inserts. The new packaging provides enhanced protection of the DMP inserts during the shipping and handling process. As an additional benefit, the box ...
TE Connectivity: Next-Gen Solutions
Publication Date: 10/31/2011

London, UK — TE Connectivity is featuring many new technologies including Electrical Network Solutions & Cable and Management in support of next generation aircraft EWIS and current return requirements.
Surface Analysis Software for Zeiss Microscopes
Publication Date: 10/31/2011

Thornwood, NY — Carl Zeiss and Digital Surf have signed an agreement enabling Carl Zeiss to provide ConfoMap® software. ConfoMap is a surface imaging and analysis software for confocal microscopes and compound microscopes for topographical research.
Seica: Fast Prober, ICT and Boundary Scan
Publication Date: 10/31/2011

Strambino, Italy — Electronic test solutions from Seica start with the Pilot V8 Flying Prober with automatic loader; continue with the innovative in-circuit and functional line tester, Compact SL. Then there is the Firefly Laser Selective Soldering system. In addition, the company's test equipment ...
SEHO: Modular soldering System
Publication Date: 10/31/2011

Erlanger, KY — SEHO's SelectiveLine, is a modular system concept for mini-wave soldering that may be adapted to changing production conditions at any time. With low production quantities, for example, only the SelectiveLine solder module is required. With increasing throughput requirements or very ...
Purex Develops New Fume Extraction System
Publication Date: 10/31/2011

Rotherham, UK — Purex International has introduced a new fume extraction machine to protect workers from exposure to hazardous solder fumes. When soldering without effective control, solder flux fumes are likely to enter the breathing zone of the solderer, which can lead to the development of occupational ...
Plasma Etch Intros Convertible Plasma
Publication Date: 10/31/2011

Carson City, NV — Plasma Etch has introduced a new plasma system that incorporates two individual plasma etching/cleaning type/mode technologies into one complete standalone plasma etching/cleaning system. Called the PE-100 Convertible, it gives the user the ability to switch back and forth between ...
Pemtron: Solder Paste Inspection Solutions
Publication Date: 10/31/2011

Seoul, Korea — Pemtron is introducing the new TROI 2200TL table top and TROI 5700HL in-line 3D solder paste inspection systems. The systems are now available in two new models: the TROI 5700HL system offering in-line, high-resolution, high-speed, dual projection 3D solder paste inspection for large PCB boards, up to 500 x 460mm (20 x 18-in.) and the new TROI 2200TL tabletop ...
Orpro Vision: Advanced Inspection Systems
Publication Date: 10/31/2011

Hameln, Germany — ORPRO Vision is showcasing its AOI systems — its complete range of paste and component inspection systems and the new benchtop for post-placement and post-solder inspection.
Omron Focuses on High-Speed PCB Inspection Solutions
Publication Date: 10/31/2011

Schaumburg, IL — Omron Inspection Systems is introducing high-speed enhancements for its VT-RNS Automated Optical Inspection System. The enhancements were developed to help manufacturers shorten program generation, improve inspection cycle time and eliminate escapes and reduce false calls while maintaining ...
Nordson DAGE Shows Bond Testing & X-ray Inspection
Publication Date: 10/31/2011

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation is showing its latest bond testing and X-ray inspection systems.
The company is showcasing its next generation 4000Plus bondtester that represents the new industry standard in bond testing with extraordinary data accuracy and repeatability. The same system also provides pad cratering  ...
MVP: AOI with New Programming Utilities
Publication Date: 10/31/2011

Carlsbad, CA — Machine Vision Products (MVP) is showing its latest solutions for the PCBA industry on the Supra-E AOI platform, which reportedly provides customers with the best cost-to-performance ratio of any AOI system.
Modular Robotic Gripper from Schunk
Publication Date: 10/31/2011

Morrisville, NC — Schunk has added a new modular long-stroke electric gripper — the LEG 400 — which can be used in the metal cutting and automotive industry, along with assembly and handling tasks. This weight-reduced, lightweight gripper is equipped with a servo motor and has a gripping force ...
Mirtec: Technologically Advanced AOI Systems
Publication Date: 10/31/2011

Oxford, CT — Mirtec's MV-7xi in-line AOI system is configured with its exclusive 10MegaPixel ISIS Vision System. This revolutionary optics system is comprised of a 10MegaPixel Top-Down camera and a Precision 13.4µ telecentric compound lens. The MV-7xi is also being configured with Four (4) Ten ...
Martin Shows Automated Rework
Publication Date: 10/31/2011

Manchester, NH — Martin's Mini-Oven 04 Reball/Prebump unit is especially suitable for the complete QFN solder bumping process, even for the smallest pitches. Using an unusual hotprint technology, the mask is not removed after printing paste, but remains on the QFN during reflow.
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