Breda, Netherlands — Cobar Solder Products' XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. According to the company, with XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.
|Lead-free solder paste. |
SN100C-XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without the need for N2 and offers a high tack force/time.
Contact: Cobar Solder Products, 53 Wentworth Avenue, Londonderry, NH 03053 603-432-7500 fax: 603-432-7519 Web: http://www.cobar.com