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Monday, September 26, 2016
VOLUME -26 NUMBER 10
Publication Date: 10/1/2011
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Production
Product Preview: productronica
October 2011 Issue
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Fujipoly Thermal Filler Helps Cool ICs
Thermally conductive material on IC ready to accept heatsink.
Carteret, NJ — An important consideration among electronics manufacturers is the damage that can be done to a thermal gap filler pad during delicate assembly and re-work operations. To help alleviate this problem, Fujipoly has introduced Sarcon
50G-Hm. This high performance, low resistance gap filler pad is manufactured with a special low-tack top surface.
This special, one-sided treatment is less sticky than the opposing surface, allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping or damaging the interface material.
The new material transfers heat with a thermal conductivity of 6.0W/m°K and a very low thermal resistance of 0.16°C-in.
/W at 72.5 PSI. This 0.5mm thick, flame retardant TIM is available in sheets up to 300 x 200mm (11.8 x 7.87-in.).
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web:
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