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Saturday, May 26, 2018
VOLUME -26 NUMBER 10
Publication Date: 10/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Production
Product Preview: productronica
October 2011 Issue
Front Page News
October '11: Giant Radiation Generators Mark Major Milestones
Albuquerque, NM — Two remarkable pulsed-power machines used to test the nation's defenses against atomic weapons have surpassed milestones at Sandia National Laboratories: 4,000 firings, called "shots," on the Saturn accelerator and 9,000 shots on the HERMES III accelerator.
Saturn — originally projected to last 5 to 10 years — began operating in 1987. Its major function has been to ...
Graphene Overtaking Carbon Nanotubes
By Cathleen Thiele, Technology Analyst, IDTechEx
Cambridge, MA — Carbon Nanotubes (CNTs) have not yet met commercial expectations from a decade ago, and now hot on their heels is graphene. Graphene is considered a hot candidate for applications such as computers, displays, photovoltaics, and flexible electronics. IDTechEx market forecasts indicate ...
North American PCB Industry Forecasts Growth
Bannockburn, IL — While the volume of North American PCB production remains flat, sales of PCBs by North American manufacturers returned to strong growth in 2010. Sales of rigid PCBs were up 18 percent and sales of flexible circuits grew 16 percent in 2010. These are among the trends explored in 2010-2011 ...
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY -
will feature its precision AuSn solder preforms at
International Microwave Symposium
(IMS) 2018 from June 10-15 in Philadelphia, Penn.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
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