Save. Share. Connect.
Friday, October 20, 2017
VOLUME -26 NUMBER 9
Publication Date: 09/1/2011
Advertisements
Front Page News
Tech-Op-Ed
Tech Watch
People in the News
Business News
Management
Electronic Mfg. Services
Electronic Mfg. Products
Production
Partnering
Distribution
Special Features: Assembly and Production
Product Preview: AATE and IPC-MW
New Products
Hi-Tech Events
Calendar
Archive
>
September 2011 Issue
>
New Products
>
Add Folder
Add Article
Add Form
Add Message Board
Add Calendar
Add Product
Fujipoly Levels Complex PCBs for Heat Sinking
Heat-sinking a large portion of densely-packed PC board.
Carteret, NJ — To help remove performance-killing heat from today's complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon
®
GR-SL, an extremely low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat.
As the company's softest gap filler pad, this unique formulation provides a thermal conductivity of 2.7W/m°K with a thermal resistance between 0.94 and 1.69°C-in.
2
/W depending on sheet thickness.
The V-0 tested Sarcon GR-SL is available in 2.5 or 5.0mm thick sheets up to a maximum 200 x 300mm dimension and has an operating temperature of -40 to +150°C.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.com Web:
http://www.fujipoly.com
search
login
{1}
##LOC[OK]##
{1}
##LOC[OK]##
##LOC[Cancel]##
{1}
##LOC[OK]##
##LOC[Cancel]##