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VOLUME -26 NUMBER 9
Publication Date: 09/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Production
Product Preview: AATE and IPC-MW
September 2011 Issue
Product Preview: AATE and IPC-MW
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Rogers Intros Power Circuit Busbars
Power circuit busbar.
Gent, Belgium and Chandler, AZ — Rogers Corporation's Power Distribution Systems Division has introduced an innovative new solution for emerging power electronics applications: RO-LINX
busbars. The PowerCircuit solution was developed to meet the growing power distribution demands in electric vehicle (EV) drives, hybrid electric vehicle (HEV) drives and related charging systems.
Other significant applications for the product include solar power inverters, uninterruptable power supplies (UPS) and industrial motor drives. The new busbars fill the gap between printed circuit board (PCB) power distribution solutions and higher power laminated busbar systems, such as Rogers' highly regarded RO-LINX laminated busbar products.
RO-LINX PowerCircuit busbars combine the performance features of power PCBs and laminated busbars. RO-LINX PowerCircuit busbars are highly engineered solutions for multilayer power distribution, delivering optimal thermal management. Unlike two dimensional (2D) power PCBs, PowerCircuit busbars can be made in three dimensions (3D) to reduce weight and footprint and to conform to specific engineering designs to maximize efficiency. In addition, PowerCircuits eliminate assembly steps at the end user reducing complexity and sources of error.
Traditional power PCBs can handle up to 100A current, limited by conductor layer thickness. Laminated busbars serve much higher power applications, generally at current levels from 500 to more than 1000A. RO-LINX PowerCircuit busbars fill the gap in designs for low-to-medium voltages and current levels. They are subsequently ideal for applications at current levels from 100 to 500 A, such as industrial variable frequency drives and HEV or EV motor drives. Furthermore RO-LINX PowerCircuit busbars can perfectly be combined with industrial mounting of functional components such as capacitors, sensors, and IGBTs.
The new busbars incorporate a closed mold design, using carefully selected materials engineered for high performance reliability in applications subject to conditions of high vibration and temperature cycling, such as in EV or HEV drives. 3D designs are well suited for medium-to-high-volume assembly and most soldering processes. The RO-LINX PowerCircuit busbars are also compatible with a number of different interconnect systems, including press fit, bolted-on, riveted, and common soldering methods assuring functional compatibility both with today's and tomorrow's assembly technologies.
According to the company, the busbars offer excellent thermal management properties and achieve high power efficiencies while minimizing switching losses and reducing dangerous partial discharge and transients. They are suitable for use at lower to medium voltages, to about 690V, and are compact and lightweight enough to support the latest power electronics designs in EVs and HEVs plus other mobile applications.
Contact: Rogers Corporation, P.O. Box 188, Rogers, CT 06263-0188
860-774-9605 fax: 860-779-5509 Web:
See at IPC Midwest Booth #219.
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