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Publication Date: 09/1/2011
Archive >  September 2011 Issue >  Product Preview: AATE and IPC-MW > 

Henkel: Conductive Die Attach Films
New adhesive delivers film-based die attach advantages for leadframe applications.
Irvine, CA — Henkel has worked with STMicroelectronics, one of the world's largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Henkel's Ablestik C100 conductive die attach film materials. The materials are designed for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions.

Commercialized in early 2011 following process testing at ST, Henkel's Ablestik C100 materials — available in 15 and 30µ thicknesses — are now extending the proven advantages of film-based materials to leadframe applications. Notable among the benefits are the elimination of die tilt, the ability to process thinner die and the facilitation of greater bondline control.

Providing a high level of manufacturing latitude, the workability of the new materials has been established on die sizes ranging from 0.2 x 0.2mm up to 6 x 6mm for multiple package types, including both QFNs and QFPs. These benefits, along with Ablestik C100's thermal and electrical performance and ability to enable scalable package design, offer a distinct competitive advantage for leadframe packaging specialists.

For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes. Because film-based die attach materials eliminate the fillet inherent with paste-based media and offer a lower die-to-paddle clearance, the adhesive extends much greater design freedom, allowing a single leadframe design to be used for multiple package types. In addition, the new conductive film formulations have excellent wetting ability and a lower bonding temperature, which enables stable adhesion on all leadframe surface finishes for even greater packaging flexibility.

Contact: Henkel Corp., 1400 Jamboree Rd., , Irvine, CA 92606 714-368-8000 949-789-2500 fax: 714-368-2265 E-mail: Web:

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