Friday, December 15, 2017
VOLUME -26 NUMBER 9
Publication Date: 09/1/2011
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Archive >  September 2011 Issue >  Front Page News > 
Solar Cells Empower Tribal Energy

Albuquerque, NM — Most Americans take electric power for granted, but for thousands of people living on tribal lands, getting to the grid can be a challenge. A lack of infrastructure, transmission capabilities and policies impede the availability of electricity within the reservations and to outlying ...
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NIST Physicists Entangle Atoms with Microwaves

Boulder, CO — Physicists at the National Institute of Standards and Technology (NIST) have for the first time linked the quantum properties of two separated ions (electrically charged atoms) by manipulating them with microwaves instead of the usual laser beams, suggesting it may be possible to replace an exotic ...Read More
PCB Production Up Sharply Worldwide

Bannockburn, IL — Worldwide production of printed circuit boards (PCBs) grew by 19 percent over 2009 to nearly $55 billion, according to the World PCB Production Report for the Year 2010, recently released by IPC — Association Connecting Electronics Industries®. Read More


 
 
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveniĀ® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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