Save. Share. Connect.
Thursday, July 20, 2017
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: Autotestcon
August 2011 Issue
Add Message Board
Lead-Free Soldering Symposium Scheduled at SMTAI
Minneapolis, MN — The SMTA's renamed Lead-Free Soldering Technology Symposium will be held on October 20, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The scope of this year's symposium is the reliability of interconnections, particularly those studied in the second phase of the NASA-DoD Pb-Free Consortium project.
The project is providing unprecedented data on the long-term performance of Pb-free interconnections, addressing alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. Session topics include an Overview and Update of the NASA-DoD Lead-Free Electronics Project, Investigating the Edges of Lead-Free Assembly Processes, Mechanical Reliability Performance of Lead-Free Solder Alloys, and the Impact of Alloy Composition, Design and Load Parameters in Lead-Free Solder Joint Reliability.
Papers will be presented by speakers from IBM, Celestica, Boeing, NASA, Rockwell Collins, Alcatel-Lucent and Amkor Technology among others. "Programmatic Challenges of Pb-Free Technology for the High-Reliability Electronics Industry" is the title of the keynote address given by Paul Vianco, Ph.D., Sandia National Laboratories and symposium chair and co-organizer.
Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM