Save. Share. Connect.
Monday, August 21, 2017
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
Advertisements
Front Page News
Tech-Op-Ed
Tech Watch
People in the News
Business News
Management
Electronic Mfg. Services
Electronic Mfg. Products
Production
Partnering
Distribution
Special Features: Test and Measurement
Product Preview: Autotestcon
New Products
Hi-Tech Events
Calendar
Archive
>
August 2011 Issue
>
Electronic Mfg. Products
>
Add Folder
Add Article
Add Form
Add Message Board
Add Calendar
Add Product
Cobar: Hi-Performance Lead-Free Solder Paste
Lead-free solder paste.
Breda, Netherlands — Cobar Solder Products' XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. According to the company, with XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.
SN100C-XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without the need for N
2
and offers a high tack force/time.
Contact: Cobar Solder Products, 53 Wentworth Avenue, Londonderry, NH 03053
603-432-7500 fax: 603-432-7519 Web:
http://www.cobar.com
search
login
{1}
##LOC[OK]##
{1}
##LOC[OK]##
##LOC[Cancel]##
{1}
##LOC[OK]##
##LOC[Cancel]##