Save. Share. Connect.
Saturday, December 16, 2017
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: Autotestcon
August 2011 Issue
Electronic Mfg. Products
Add Message Board
Henkel Conductive Die-Attach Films Enable Leadframe Packages
Irvine, CA — Henkel has worked with STMicroelectronics, one of the world's largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Ablestik C100 conductive die attach film materials. The Ablestik is being used for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions.
Commercialized in early 2011 following process testing at ST, the Ablestik C100 materials, available in 15µ and 30µ thicknesses, are now extending the proven advantages of film-based materials to leadframe applications. Notable among the benefits of these conductive films are the elimination of die tilt, the ability to process thinner die, and the facilitation of greater bondline control.
Providing a high level of manufacturing latitude, the workability of the new materials has been established on die sizes ranging from 0.2 x 0.2mm up to 6 x 6mm for multiple package types, including both QFNs and QFPs. These benefits, along with Ablestik C100's thermal and electrical performance and ability to enable scalable package design, offer a distinct competitive advantage for leadframe packaging specialists.
For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes. Because film-based die attach materials eliminate the fillet inherent with paste-based media and offer a lower die-to-paddle clearance, the new adhesive provides much greater design freedom, allowing a single leadframe design to be used for multiple package types. In addition, the new conductive film formulations have excellent wetting ability and a lower bonding temperature, which enables stable adhesion on all leadframe surface finishes for even greater packaging flexibility.
Contact: Henkel Corp., 1400 Jamboree Rd., , Irvine, CA 92606
714-368-8000 or 949-789-2500 fax: 714-368-2265 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM