Wednesday, May 23, 2018
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
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Archive >  August 2011 Issue >  Front Page News > 
Sandia Sends Historic Robots to Smithsonian

Albuquerque, NM — In a nod to Sandia Labs' contributions to the field of robotics, the Smithsonian Institution has obtained nine of Sandia's historically significant robots for its permanent collection at the National Museum of American History.
 
"For the Smithsonian to request Sandia technology for their collections is an external recognition of the significance of Sandia National Laboratories' contributions to the nation," ...
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Advances in Tactical Radio Accessories


Just as in any line of work, effective communication is a must within the military. However, unlike most work scenarios, soldiers' ability to communicate effectively can be a matter of life and death. Troops must be able to relay timely messages through a secure network in order to ...Read More
IPC Releases New Update of PCB Cleaning Guidelines

Bannockburn, IL — IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies. The new guidelines are intended to deal with the problem of residues on printed board assemblies that can lead to serious reliability problems. Over the past several years the migration from ...Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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