Tuesday, September 27, 2016
VOLUME -26 NUMBER 7
Publication Date: 07/1/2011
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Archive >  July 2011 Issue >  Product Preview: Semicon West > 

Sikama: New Oven for Wafer Bumping
Oven for wafer bumping.
Santa Barbara, CA — Sikama International, Inc. has released its newest reflow solder/curing oven — the Ultra Profile 1200. The new oven is a multi-purpose, continuous flow, reflow and curing oven capable of temperatures up to 400°C and atmosphere levels as low as 10ppm O2.

The new unit extends the company's offering of 300mm ovens with the addition of this bottom conduction, top convection oven. With eight work zones internal to the oven — six heat zones and two cooling zones — the oven is capable of a wide variety of processes. This versatile oven can be used in solder reflow applications from 300mm 10µm wafer bumping to 5kg microwave power modules as well as for epoxy curing. The oven's "Walking Beam" transport mechanism is designed to move even the heaviest of these work items from zone-to-zone through the oven with ease.

The company's ovens are well known in the wafer bump industry and the factory has already received orders from two major wafer fabs and an LED chip manufacturer for this newest member of its oven lineup.

Incorporating the company's Falcon ICS 412 Flux Coater with the Ultra Profile 1200 creates a system capable of processing 6 to 12-in. wafers (flux and reflow) in a multi-zone, in-line system with a small 1.2 x 5.7 meter footprint.

Contact: Sikama International, 118 E. Gutierrez St., Santa Barbara, CA 93101 805-962-1000 fax: 805-962-6100 E-mail: sales@sikama.com Web:
http://www.sikama.com


 
 
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