Save. Share. Connect.
Tuesday, August 30, 2016
VOLUME -26 NUMBER 7
Publication Date: 07/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: SMT and Production
Product Preview: Semicon West
July 2011 Issue
Electronic Mfg. Products
Add Message Board
DuPont: New Lower-Silver PV Paste
Solder paste with lower silver content.
Research Triangle Park, NC — DuPont Microcircuit Materials (MCM) is accelerating the completion of a breakthrough technology innovation that is enabling the company to develop formulations for a new series of its leading DuPont
brand photovoltaic (PV) metallization pastes that significantly reduce the silver content. This development will help offset some of the impact that rising silver prices have on the cost of producing solar cells and modules.
DuPont expects to commercialize the first generation of lower silver Solamet pastes later this year, and based on preliminary MCM lab evaluations, the company anticipates that the first generation products will have a reduced silver content of over 10 percent. The company expects that ongoing research efforts will enable the development of subsequent generations of the products with the silver content reduced by as much as 20 percent compared to today's existing products. The development is part of MCM's roadmap of proposed technology options to enable the industry goal for conversion efficiency of crystalline silicon (c-Si) solar cells beyond 20 percent by 2012, and to help lower the cost of PV generated energy.
According to the company, it is working aggressively to reduce customer reliance on silver as a basic conductive material, to reduce cell and module costs today and enable a more stable cost structure in the future. DuPont Solamet PV17A, launched at SNEC in February, reportedly already substantially reduces the amount of paste needed to produce a solar cell, and the company continues to put its science to work by lowering the silver content in the paste itself with this anticipated new product system.
MCM has a history of success in enabling cost reductions through new material innovations without compromising performance. We are looking forward to introducing this system to the market.? The lower-silver photovoltaic metallization paste system is comprised of new frontside silver and tabbing pastes, which the company anticipates will be near drop-in replacements for many applications.
MCM has introduced several new Solamet products this year and continues to focus on accelerated product development programs that help lower costs and raise efficiency, and capacity expansions to support the fast growing PV industry.
Contact: DuPont Circuit & Packaging Materials, 14TW Alexander Drive, Research Triangle Park, NC 27709
800-243-2143 fax: 570-268-3699 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM