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VOLUME -26 NUMBER 6
Publication Date: 06/1/2011
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Electronic Mfg. Services
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Special Features: Test and Measurement
Product Preview: Atlantic Design / MDM
June 2011 Issue
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Semicon West to Feature Extreme Electronics
San Francisco, CA — Advanced nano- and microelectronics manufacturing technology are continuing to enable extreme cost reductions, performance increases and quality improvements in high-growth HB-LEDs, MEMS, next generation power solutions and printed electronics markets. Many of these recent developments and future challenges in manufacturing efficiency and effectiveness will be featured in Extreme Electronics, the dedicated "show within a show" at SEMICON West, North America's premier nano- and microelectronics manufacturing exposition, held July 12-14 at the Moscone Center in San Francisco, California.
Over 20 free technical sessions at the show-floor Extreme Electronics TechXPOT stage and hundreds of exhibitors with manufacturing solutions applicable to many emerging markets will be featured at this year's event.
SEMI members and SEMICON exhibitors are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day. Technological advances go beyond just semiconductors. The science used to make microchips is also enabling advances in solid-state lighting, flexible displays and PV, micro-machines, thin film sensors, new power ICs, and many other emerging technologies. Extreme Electronics is a dedicated exhibition area and presentation forum for technical presentations on the key challenges, trends and break-through solutions addressing these high-growth markets.
Solid State Lighting and HB-LED — More Lumens per Dollar: Issues and Answers to Bring Costs Down to Create the General Lighting Market. Speakers are expected from Cree, Philips Lumileds, Veeco, Dow Electronic Materials, UCSB, Fraunhofer IZM, Redwood Systems, Intematix, NNCrystal, Cascade Microsystems, KLA-Tencor and more.
The Future of MEMS: Solutions for Moving from a Niche to a Mainstream Business will have speakers from GlobalFoundries, Teledyne Dalsa, Bosch, IMEC, Sand 9 and Yole Developpement. Opportunities in Smart Power Management for Alternative Energy Applications will have speakers from Freescale, Yole Developpement, Oakridge National Labs, International Rectifier, SemiSouth, and IBM. Printed/Flexible Electronics — Beyond R&D to Real Deal Technologies will have speakers from FlexTech Alliance, Novacentrix, Xenon and more.
The ATE Test Technology Technical Council (TTTC) of the IEEE Computer Society will hold its ATE Vision 2020 Conference on July 14, 2011 during the annual SEMICON West exposition — not quite co-located, but at the San Francisco Marriott Marquis. ATE Vision 2020 occupies a unique role in the semiconductor test industry as the only dedicated forum to discuss technology gaps needing advancement by test instrumentation, automated test equipment (ATE) developers, test equipment users, and other key contributors to the test industry.
Winner of the Most Successful Event Award of the IEEE/TTTC for two years, the 2011 conference will focus on emerging issues in semiconductor test including, but not limited to, SoC, 3DIC, 450 mm wafers, and new functionality in RF, mixed signal and other applications.
Through technical papers, panels and interactive discussions, the one-day event will examine the direction and requirements of the ATE and test industry as integrated circuits continue to get denser, faster, and highly heterogeneous.
Technical papers are expected to cover such areas as multiple cores on a die, 3D trends enabled by die-stacking and thru-silicon-vias (TSVs), adaptive test, BIST, and other areas. The conference's objective will be to explore technology needs as they relate to the cost-of-test, time-to-market, and time-to-yield needs of the industry.
"Test is playing an increasingly critical role in next generation semiconductors, both as an enabling technology and as a potential gating factor," said Erik Volkerink, chief technologist of Verigy, and founder and general chair of ATE Vision. "Identifying test technology gaps and needs in critical areas such as 3D chip stacking and 450mm wafers are essential today to enable tomorrow's advanced chips. This year's program will be designed to complement SEMICON West's TechXPOT test sessions with more technical presentations and more interactive sessions with key industry stakeholders."
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