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Publication Date: 06/1/2011
Archive >  June 2011 Issue >  Product Preview: Atlantic Design / MDM > 

Henkel: New No-Clean Flux
No-clean flux applied by spray nozzles.
Irvine, CA — Designed to meet today's manufacturing requirements, Henkel Electronic Materials has formulated Multicore MF210, a no-clean sustained-activity flux that is compatible with both lead-free and tin-lead processes. The halide-free, resin-free material is effective with a wide range of solder resists, as well as rosin and OSP-based protectants for maximum adaptability.

The product's wide process window affords electronics specialists the latitude necessary to accommodate varying conditions for both tin-lead and lead-free manufacturing. With a pre-heat temperature range of 80 to 130°C and a one- to three-second contact time on the wave, Multicore MF210 delivers sustained activity without resin even in the most demanding environments. The material's special formulation enables its use in both single- and dual-wave processes, with no degradation in activity level and its low solids content results in very low residue levels for a no-clean operation. The material's sustained activity level ensures that cleaning of OSPs and highly oxidized bare copper is extremely effective, thereby enabling excellent solder wetting and through-hole penetration. In addition, the activity capability helps reduce solder microballing by improving coalescence and limiting the presence of stray particles around the solder joint.

Suitable for any process where high throughput is a necessity and minimum flux residue is a key requirement, the product's performance has been proven for multiple applications in the consumer electronics, automotive and alternative energy sectors.

The flux can be used in various environments with differing conditions and will consistently give back exceptional results.

Contact: Henkel Corp., 1400 Jamboree Rd., , Irvine, CA 92606 714-368-8000 949-789-2500 fax: 949-785-2595 E-mail: Web:

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