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Thursday, December 8, 2016
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: EDS
May 2011 Issue
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Fujipoly: Silicone Thermal Interface
Thermal transfer stick-on material.
Carteret, NJ — Fujipoly's Sarcon
XR-v-AL is a uniquely formulated silicone thermal interface material that offers the installation flexibility of a putty-like sheet and the performance of a high-end gap filler pad. The product provides a remarkable thermal conductivity of 6.0 W/m°K and thermal resistance of just 0.04°C-in.
The non-flammable, peel-and-stick interface material is only 0.11mm (0.0043-in.) thick and can quickly be applied to almost any electronic component or heat sink with the ease of an adhesive label. The material is available in sheet form on an easy-release carrier in sizes up to a maximum 50 x 50mm (2 x 2-in.). Once applied, this thermal interface material exhibits an extremely low contact resistance and efficiently transfers heat from its source to a heat sink or spreader.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web:
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